Berlin, Heidelberg: Springer, 2004. — 499 p., 372 fig., 25 tables. — (Springer Series in Materials Science, vol. 75). — ISBN10: 3540210490, ISBN13: 9783540210498. During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by...
2nd ed. — McGraw-Hill, 2006. — 792 p. New developments in aerobic and anaerobic treatment; Expanded coverage of treatment systems for specific pollutants; New material on membrane treatment processes; New developments in cost-saving treatment design methods; Includes the latest regulations.
American Society for Testing and Materials, 1991. - 3 pp. Настоящий стандарт относится к области поиска течей в вакуумной технике. В стандарте содержится классификация методов течеискания и руководство по выбору метода. This guide is intended to assist in the selection of a leak testing method. Scope. Referenced Document. Terminology. Selection of System. Leakage Measurement....
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I), West Honshohoken, PA: ASTM Intl., 2001. - 5 p. - Approved 1987, reapproved 1999.
These test methods cover techniques for determining the crystallographic orientation of a surface which is roughly parallel to a low-index atomic plane in single crystals used primarily for semiconductor devices. Two test methods are...
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I), West Honshohoken, PA: ASTM Intl., 2001.- 8 p. Approved 1991, reapproved 1997.
These test methods cover the measurement of minority carrier lifetime appropriate to carrier recombination processes in bulk specimens of extrinsic single-crystal germanium and silicon by measurement of photoconductivity decay after...
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I). - West Honshohoken, PA: ASTM Intl., 2001. - 6 p. - Reapproved in 1997. These test methods cover the determination of the conductivity type of extrinsic semiconductors, especially germanium and silicon.
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I), West Honshohoken, PA: ASTM Intl., 2001. - 6 p. These test methods cover two procedures: - Method A, Two-Probe, - Method B, Four-Probe. These procedures apply directly to both silicon and germanium. Application to other semiconductors may require the use of different probe material and probe attachments.
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I), West Honshohoken, PA: ASTM Intl., 2001. - 13 p. - Reapproved 1996. These test methods cover two procedures differing most substancially in test specimen requirements, especially their shape: - Method A, van der Pau, - Method B, Parallelepiped, or Bridge-Type.
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I), West Honshohoken, PA: ASTM Intl., 2001. - 9 p.
This test method provides procedures for the determination of relative radial resistivity variation of semiconductor wafers cut from silicon single crystals grown either by the Czochralski or floating-zone technique.
Описан метод определения относительной радиальной...
American Society for Testing and Materials, 1983. - 6 pp.
This test method applies to hermetic package leak testing to detect leaks of a broad spectrum in size with a mimimum detection limit equal to the sensitivity of the helium mass spectrometer equipment used in the test.
Настоящий стандарт относится к области определения вакуумных течей в герметичных корпусах, и...
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I), West Honshohoken, PA: ASTM Intl., 2001. - 13 p.
This test method covers the measurement of the resistivity of silicon wafers with a in-line four probe measurements.
In: Annual Book of ASTM Standards vol. 10.04 (Electronics I), West Honshohoken, PA: ASTM Intl., 2001. - 7 p. - Reapproved 2000.
This test method provides a technique for measurement of thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates using an infrared dispersive spectrophotometer.
Weinheim, Germany: Wiley-VCH, 2017. — xxv, 281 p. Combining the two topics for the first time, this book begins with an introduction to the recent challenges in energy conversion devices from a materials preparation perspective and how they can be overcome by using atomic layer deposition (ALD). By bridging these subjects it helps ALD specialists to understand the requirements...
NY: Plenum Press, 1984. — viii, 367 p. — The IBM Research Symposia Series. — ISBN: 978-1-4684-4849-8, 978-1-4684-4847-4. The papers collected in this volume were presented at the International Symposium on Methods and Materials in Microelectronic Technology. This symposium was sponsored by IBM Germany, and it was held September 29 - October 1, 1982, in Bad Neuenahr, West...
InTech, 2011. — 344 p. The exciting world of crystalline silicon is the source of the spectacular advancement of discrete electronic devices and solar cells. The exploitation of ever changing properties of crystalline silicon with dimensional transformation may indicate more innovative silicon based technologies in near future. For example, the discovery of nanocrystalline silicon...
InTech, 2011. — 466 p. — ISBN: 978-953-307-163-3. Photodiodes, the simplest but most versatile optoelectronic devices, are currently used in a variety of applications, including vision systems, optical interconnects, optical storage systems, photometry, particle physics, medical imaging, etc. Advances in Photodiodes addresses the state-of-the-art, latest developments and new...
N.-Y.: Springer Science+Business Media, 1997. — xxii, 358 p. — ISBN: 978-1-4899-1806-2, 978-1-4899-1804-8. Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide...
Pittsburgh, Pennsilvania: Materials Research Society, 1993. - 379 pp.
Proceedings of the Conference ((Ninth Workshop on Adavanced Metallization) held October 20-22, 1992 in Tempe, Arizona.
Hot topics include tungsten metallization, "hot" aluminum and copper metallization, titanium nitride barriers and silicides.
The program included also the seccion on the reliability of...
Westport, Connecticut; London: Greenwood Press, 2008. — LV, 232 p. — ISBN: 0313320861.
Книга вышла в серии "Reference Guides to National Architecture".
Иллюстрированный справочник по архитектуре Италии за весь исторический период - от эпохи греческих колоний в Италии (с 7 в. до н. э. ) до наших дней.
Включена информация по 75 наиболее известным архитектурным памятникам...
Springer, 2001. — xiii, 262 p. — (Springer Series in Materials Science 46). — ISBN: 978-3-642-62583-1, 978-3-642-56711-7. This book presents fundamental experimental and theoretical developments relating to silicon oxidation for ultra-thin gate oxide formation. Starting with elementary processes taking place during wet chemical cleans prior to oxidation, the focus is then...
Boca Raton, FL: CRC Press, 2011. - 207 p. - ISBN10: 1439862052, ISBN13: 978-1-4398-6205-6, 978-1-4398-6207-0. History and background Package form factors and families Surface-mount technology Other packaging needs Reliability testing Polymers Metals Ceramics and glasses Trends and challenges Light-emitting diodes In semiconductor manufacturing, understanding how various...
Dordrecht, The Netherlands: Springer, 2005. - 477 p. This book presents the fundamentals of novel gate dielectrics that are being introduced into semiconductor manufacturing to ensure the continuous scaling of CMOS devices. As this is a rapidly evolving field of research we choose to focus on the materials that determine the performance of device applications. Most of these...
Woodhead Publishing & ASM International, 1993. - 3rd ed. (Woodhead Publishing Series in Metals and Surface Engineering). - xiii, 449 p. - ISBN10: 1855730812, ISBN13: 978-1855730816. During the last decade the engineering applications for nickel and chromium coatings have gained in importance. In this third edition the chapter dealing with engineering applications has been...
Springer, 2006. -349 p. (Springer Series in Advanced Microelectronics, vol. 24).
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be...
Norwich, NY: William Andrew Publishing, 2006. — 277 p. — ISBN 978-0-8155-1919-5, 978-0-8155-1523-4. This book describes and illustrates the surface preparations and operations that must be applied to a surface before acceptable adhesive bonding is achieved. It is meant to be a comprehensive overview, including more detailed explanation where necessary, in a continuous and...
2nd ed. — Amsterdam: William Andrew, 2014. — 337 p. — ISBN 978-0-323-26435-8. Aimed at engineers and materials scientists in a wide range of sectors, this book is a unique source of surface preparation principles and techniques for plastics, thermosets, elastomers, ceramics and metals bonding. With emphasis on the practical, it draws together the technical principles of surface...
Trans Tech, 2010. — 172 p. — (Diffusion and Defect Data, Part A, Defect and Diffusion Forum, v. 302). — ISBN: 978-3-03813-381-0, 978-3-90845-185-3, 3038133817. This work is essentially an update of previous compilations of information on the diffusivity of elements in semiconductor-grade silicon. It subsumes the data contained in B.L. Sharma’s monograph on ‘Diffusion in...
Boca Raton, FL: CRC Press, 2009. — 753 p. — ISBN: 9781420043761, 1420043765. Uncover the defects that compromise performance and reliability as microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes...
New York, London: Academic Press, 1971. - ix, 370 p., ill. Sixth volume in Series "Physics of Thin Films: Advances in Research and Development". Anodic Oxide Films. C.J. Dell'oca, D.L. Pulfrey, L. Young Size-Dependent Electrical Conduction in Thin Metal Films and Wires. D.C. Larson Optical Properties of Metallic Films.F. Abelés Interactions in Multilayer Magnetic Films. Arthur...
2nd edition. — CRC Press; Taylor & Francis Group, 2006. — 547 p. The 3rd volume of 3 volume set: The MEMS Handbook, Gad-el-Hak, Mohammed (Ed). As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused,...
Berlin, Heidelberg, New York: Springer, 1982. — 234 p. — (Crystals - Growth, Properties, and Applications. Vol.8). — ISBN13: 978-3-642-68767-9. Zulehner W. and Huber D. Czochralski-Grown Silicon. Fundamentals of Silicon Czochralski Growth. The Crystal-Melt Interface and the Incorporation of Impurities. Impurities. Crystal Defects. Technical Aspects. Wafer Manufacture....
2nd ed., revised. — Springer-Verlag Berlin Heidelberg, 2000. – xv, 269 p. – (Springer Series in Materials Science, vol. 24). — ISBN: 978-3-642-62965-5,978-3-642-57121-3. This book treats the transition-metal impurities generated during the fabrication of silicon samples and devices. The different mechanisms responsible for contamination are discussed, and a survey is given of...
3rd edition. — McGraw-Hill, 2010. — 448 p. The Industry Standard Guide to Wire Bonding - Fully Updated. The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This...
Elsevier Science, 2006. — 1157 p. — ISBN: 008044699X, 9780080446998. The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology. "Principles of Vapor Deposition of Thin Films" brings in to one place a diverse amount of scientific background that is considered essential...
2nd edition. — Noyes Publications/William Andrew, 2001. — 1022 p.
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist coatings, including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process...
Academic Press, 1997. San Diego, London, New York, Tokyo, Toronto. - XXII, 839 p. ISBN: 0-12-352065-7. Fundamentals of Vacuum Technology and Surface Physics. Creation of Vacuum. Vacuum Measurements. System Design and Components. Vacuum Applications. Large-Scale Vacuum Based Processes. Publisher's review The Handbook of Vacuum Science and Technology consists of the latest...
Cambridge: Royal Society of Chemistry, 2009. — xv, 582 p. — ISBN: 0854044655, 978-1-62198-703-1, 978-0-85404-465-8. Chemical Vapour Deposition (CVD) involves the deposition of thin solid films from chemical precursors in the vapour phase, and encompasses a variety of deposition techniques, including a range of thermal processes, plasma enhanced CVD (PECVD), photon- initiated...
CRC Press, 2007. — 539 p. — ISBN: 0849390052, 9780849390050, 9781420008265. Drawing on Frank G. Kerry’s more than 60 years of experience as a practicing engineer, the Industrial Gas Handbook: Gas Separation and Purification provides from-the-trenches advice that helps practicing engineers master and advance in the field. It offers detailed discussions and up-to-date approaches...
Oxford: Pergamon Press, 1988. — 150 p. — (Pergamon Materials Engineering Practice Series). — ISBN: 978-0-08-031138-8, 0080311385. Mechanical and Textured Finishes. Cleaning. Chemical Finishing. Electroplating on Aluminium. Chemical Colouring of Aluminium. Conversion Coatings as Pretreatments for Painting and Protection. Protective and Decorative Air-drying Coatings. Application...
2nd ed., revised and expanded. — Marcel and Dekker, 2001. — 640 p. — (Surfactant Science Series, vol. 97). — ISBN10: 082470472X; ISBN13: 978-0824704728. A discussion of the synthesis, problems, theories and applications of fluorinated surfactants, this second edition is updated with four new chapters on repellency and protection against soiling and staining and over 2900...
Springer-Verlag Berlin Heidelberg, 1967. — x, 134 p., 57 ill. — ISBN: 978-3-662-39204-1,978-3-662-40210-8. General Review of the Effect of Silicon-Dioxide Coatings on the Surface Properties of Silicon and the Importance of these Coatings in Semiconductor- Device Technology. Bulk properties of silicon Imperfections at the surface of a silicon crystal. Physical model of an...
2nd English edition. Tokyo: Kurita Water Industries Ltd. , 1999. - 499 p. Hosokawa, T. , Iwasaki, M. , Komatsubara, H. (Eds. ) Introduction to Water Treatment. Necessity of Water Treatment. Development and Recent Trends of Water Treatment Chemicals. Science of Water. Basic Chemistry for Water Treatments. Water Treatment and Chemicals for Boiler Water Systems. General Boiler...
2nd Ehglish edition. Tokyo: Kurita Water Industries Ltd. , 1999. - 499 p. Hosokawa, T. , Iwasaki, M. , Komatsubara, H. (Eds. ) Water Treatment for Air Conditioning Systems. Water Treatment for Cooling Water Systems. Water Treatment of Closed Recirculating Water Systems for Air Conditioning. Water Treatment for High Temperature Water Systems in District Air Conditioning Plants....
Dordrecht: Kluwer Academic Publishers, 1989. - xiv, 984 p. - ISBN: 978-0-7923-0154-7,978-94-009-0917-5. - (NATO Advanced Science Institute Series E, vol. 164). The primary thrust of very large scale integration (VLSI) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in...
Springer, 1990. — xi, 438 p. — (NATO Advanced Science Institute Series, vol. 207). — ISBN: 978-1-4612-7857-3, 978-1-4613-0541-5. As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first...