Association Connecting Electronics Industries. Joint Industry Standard (IPC). April 2010. Supersedes Revision IPC J-STD-001D-2006. 72 p. This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and...
Association Connecting Electronics Industries. Joint Industry Standard (IPC). December 2010. 26 p. This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC J-STD-001E to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to...
Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). March 2008. Supersedes IPC/JEDEC J-STD-020D-2007. 22 p. The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged,...
Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). June 2007. Supersedes IPC/JEDEC J-STD-020C-2004. 22 p. The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored,...
Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). October 2005. Supersedes IPC/JEDEC J-STD-033A-2002. 26 p. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages that have been classified to the...
Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). MAY 1999. 18 p. This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compound...
Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). January 2009. 8 p. This standard provides definitions, optional test methods, marking and labeling recommendations, and targeted materials and systems to define a low-halogen technology. This document could be used to apply to all materials and parts of electronic...
Association Connecting Electronics Industries (IPC) and Wiring Harness Manufacturer's Association (WHMA). January 2002. 282 p. This standard is a collection of visual Quality Acceptability Requirements for Cable, Wire and Harness Assemblies. It was prepared by the ITGC Industry Technical Guidelines Committee of the Wire Harness Manufacturers Association and the Product...
Association Connecting Electronics Industries (IPC) and Wire Harness Manufacturers Association (WHMA). July 2006. Supersedes IPC/WHMA-A-620-2002. 372 p. This standard is a collection of visual Quality Acceptability Requirements for Cable, Wire and Harness Assemblies. It was prepared by the ITGC Industry Technical Guidelines Committee of the Wire Harness Manufacturers...
Association Connecting Electronics Industries (IPC) and Wire Harness Manufacturers Association (WHMA). July 2006. Supersedes IPC/WHMA-A-620-2002. 372 p. This standard is a collection of visual Quality Acceptability Requirements for Cable, Wire and Harness Assemblies. It was prepared by the ITGC Industry Technical Guidelines Committee of the Wire Harness Manufacturers Association...
Association Connecting Electronics Industries (IPC). June 2012. Supersedes IPC/WHMA-A-620AS-2011. 44 p. This addendum provides additional requirements over those published in IPC/WHMA-A-620A to ensure the performance of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. Where content criteria are...
Association Connecting Electronics Industries. Joint Industry Standard (IPC). March 2000. 14 p. This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment. It...
Association Connecting Electronics Industries (IPC). May 2003. 22 p. This standard establishes the generic and specific guidelines for the design of metallic conductors in organic printed boards and other material that may be homogeneous, reinforced, or used in combination with inorganic materials
Association Connecting Electronics Industries (IPC). May 2003. Supersedes: IPC-2221-1998. 124 p. This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections...
Association Connecting Electronics Industries (IPC). May 2003. Supersedes: IPC-2221-1998. — 124 p. Переведено на русский язык ФГУП ВНИИА. This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with...
Association Connecting Electronics Industries (IPC). July 2003. 36 p. The intent of this standard is to establish the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. Wherever possible, existing and widely accepted protocols have been utilized. Certain guaranteed behaviors have...
Association Connecting Electronics Industries (IPC). March 2000. 199 р. This standard specifies a data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements. These formats may be used for transmitting information between a printed board designer and a...
Association Connecting Electronics Industries (IPC). January 2002. 182 р. This standard specifies the XML schema that represents the data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements. This format may be used for transmitting information between a...
Association Connecting Electronics Industries (IPC). November 2000. 18 р. This standard is part of the IPC-2510 series of standards. These standards are used to specify a data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements. These formats may be used for...
Association Connecting Electronics Industries (IPC). November 2000. 26 р. This standard specifies data formats used to describe drawing methodologies for printed boards and printed board assemblies. These formats may be used for transmitting information between a printed board designer and a printed board manufacturer.
Association Connecting Electronics Industries (IPC). November 2000. 23 р. This standard specifies data formats used to describe drawing methodologies for printed boards and printed board assemblies. These formats may be used for transmitting information between a printed board designer and a printed board manufacturer.
Association Connecting Electronics Industries (IPC). November 2000. 20 р. This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed circuit board designers and printed board manufacturers. The formats are also useful when the manufacturing cycle includes...
Association Connecting Electronics Industries (IPC). November 2000. 19 р. This standard specifies data formats used to describe printed circuit board assembly product manufacturing methodologies. These formats may be used for transmitting information between a printed circuit board designers, board fabricators, and assembly manufacturers. The formats are also useful when the...
Association Connecting Electronics Industries (IPC). November 2000. 24 р. This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle...
Association Connecting Electronics Industries (IPC). November 2000. 18 р. This standard specifies data formats used to describe parts lists and bill of material generation methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers.
Association Connecting Electronics Industries. Joint Industry Standard (IPC). February 1999. 19 p. This document describes a PWB fabrication data quality rating system used by fabricators to evaluate the incoming data package integrity. Printed board designers can also use this system as an output quality check.
Association Connecting Electronics Industries (IPC). Developed by the Surface Mount Equipment Manufactures Association (SMEMA) Council of IPC. March 1999. 132 р. The purpose of this specification is to outline the requirements that an SRFF file must meet. The specification describes the file format, outlines the file sections, and indicates how data should be represented through...
Association Connecting Electronics Industries (IPC). November 2000. 24 р. This standard defines an XML encoding schema to facilitate plug-and-play characteristics in a factory’s shop-floor information system. This standard describes the generic event message content, and should be used together with the IPC-2540 series sectional documents, which define the set of messages and key...
Association Connecting Electronics Industries (IPC). January 2002. 56 р. This document describes event message content and an XML encoding scheme, that enables a detailed definition of messages in the domain of electronics inspection, test and repair/rework (i.e. product and process quality). These messages are to be encoded at a level appropriate to facilitate interoperability in...
Association Connecting Electronics Industries (IPC). November 2001. 43 р. The Product Data eXchange 1.0 standard defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The scheme is defined for bill of materials (BOM), approved manufacturer list (AML), changes (Engineering,...
Association Connecting Electronics Industries (IPC). November 2001. 15 р. This standard covers the sectional requirements for product genealogy, or as-built manufacturing information. The standard facilitates the exchange of manufacturing information between supply chain partners to support warranty tracking, product excursion containment, and product quality functions.
Association Connecting Electronics Industries (IPC). November 2001. 34 р. This standard covers the sectional requirements for the exchange of Bills of Material (BOM), Approved Manufacturer Lists (AML), Approved Supplier Lists (ASL), as well as the description of the components involved on the Bill of Material. Component data includes electrical, mechanical and package type. This...
Association Connecting Electronics Industries (IPC). May 2012. 210 р. This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a...
Association Connecting Electronics Industries (IPC). May 2007. 17 р. This standard provides the information on administrative requirements used for the ordering, request for quote, or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file usage the XML schema is reused in every...
Association Connecting Electronics Industries (IPC). May 2007. 29 р. This standard provides the information on design characteristic features intended to define the basic principles used for indicating how to document the manufacturing requirements and any special symbology needed in the data description hierarchy. Since the requirements are important to every file in order to...
Association Connecting Electronics Industries (IPC). May 2007. 44 р. This standard provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard (IPC-2581) and some of the 2580 sectional standards that are required to accomplish the focused tasks. When other standards...
Association Connecting Electronics Industries (IPC). May 2007. 14 р. This standard provides the information on parts lists/ bill of materials for product data description and may be used for the ordering request for quote or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file...
SCOPE
This specification covers the requirements for base materi-
als, herein referred to as laminate or prepreg, to be used
primarily for rigid or multilayer printed boards for electri-
cal and electronic circuits.—
Association Connecting Electronics Industries. Joint Industry Standard (IPC). February 2005. Supersedes Revision IPC-SM-782A-1999. 92 p. This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land...
Association Connecting Electronics Industries (IPC). IPC-7711, Chg 1 - May 2002. IPC-7711 - February 1998. Supersedes IPC-R-700C - January 1988. 28 p. This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee of the Product Assurance Committee of...
Стандарт IPC-7711/21B «Доработка, модификация и ремонт электронных сборок» был полностью обновлен по каждой процедуре, чтобы обеспечить возможность их применения как для бессвинцовых, так и для традиционных оловянно-свинцовых электронных сборок. Это однотомное издание содержит все ранее опубликованные изменения и несколько новых процедур для компонентов BGA (включая восстановление...
Association Connecting Electronics Industries (IPC). May 2012. Supersedes IPC-9151C-2010. 20 p. The purpose of this document is to define the Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database Program used for the evaluation of printed board manufacturing processes. This is in accordance with The National Technology Roadmap for...
Association Connecting Electronics Industries, 1999. — 52 p. IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1: Elements of SPC. This document outlines the SPC philosophy, implementation strategies, tools, and techniques used for relating process...
Association Connecting Electronics Industries, 2004. — 36 p. The IPC-9194 should be used in conjunction with IPC-9191. The IPC-9191 provides general guidelines for implementing SPC in electronics industry. This standard is intended to aid in interpretation of the requirements in IPC-9191 specifically for Printed Board Assembly (PBA) manufacture. This standard promotes process...
Association Connecting Electronics Industries, 2002. — 52 p. This document is intended to be a tool for a customer or supplier organization’s internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This document should be used by...
Настоящий стандарт устанавливает предпочтительные, приемлемые и недопустимые состояния визуально наблюдаемых и не наблюдаемых характеристик печатных плат. Он представляет собой сборник визуальных интерпретаций минимальных требований, изложенных в различных технических условиях на печатные платы.
Стандарт представляет собой совокупность требований визуальных критериев качества электронных сборок. В стандарте представлены требования приемки для производства электротехнических или электронных сборок.
Association Connecting Electronics Industries. Joint Industry Standard (IPC). February 2005. Supersedes IPC-A-610C-2000. 404 p. This standard is a collection of visual quality acceptability requirements for electronic assemblies. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards...
IPC, 1999. This revision of IPC-CH-65 covers cleaning of both bare boards and assemblies. It is intended to be a road map to cleaning which covers both current and emerging technologies.
Association Connecting Electronics Industries (IPC) and Surface Mount Equipment Manufactures Association (SMEMA). February 2007. 20 p. The SMEMA machine interface standards were developed to facilitate the interface of equipment used in the manufacture of surface-mounted printed circuit boards. This standard is for mechanical and electrical interfaces. The purpose of this...
Association Connecting Electronics Industries (IPC) and the IPC Solder Products Value Council (SPVC). July 2003. White Report. 25 p. At present there are a large number of materials that have been proposed as replacements for lead containing solder. Primary among these are the Tin/Silver/Copper (SAC) alloys. There are several variations of the Tin/Silver/Copper alloys that have...
The Institute for Interconnecting and Packaging Electronic Circuits 2215 Sanders Road • Northbrook, IL 60062-6135, p.1 IPC-TM-650 2.4.24.3 Стандарт для определения температуры стеклования Настоящий метод испытаний устанавливает процедуру определения температуры стеклования органических пленок с использованием термомеханического анализа (ТМА).
The Institute for Interconnecting and Packaging Electronic Circuits 2215 Sanders Road • Northbrook, IL 60062-6135, 1988. 3 p. IPC-TM-650 2.4.8 Прочность на отслаивание, металлическая фольга Данный метод предназначен для определения прочности на отслаивание металлической фольги при склеивании с тонкими ламинатами. Прочность на отслаивание определяется для образцов в полученном...
Association Connecting Electronics Industries (IPC). June 1999. 5 p. This test method covers three procedures used to determine the bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed panels. Measurements on nonrectangular samples pose a unique testing problem and may necessitate careful evaluation of...
Association Connecting Electronics Industries (IPC). March 2009. A Technical Report. 61 p. This technical report documents the Round Robin testing effort. The Round Robin test results were used by the 4-14 Plating Processes Subcommittee in the development of immersion silver maximum plating thickness. The Technical Report Compendium is divided into three information sets:
1. Test...
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