Quinn G.D. Fractography of Ceramics and Glasses

Washington, National Institute of Standards, 2007.- 546 c.Resources
Tools and Equipment
Low Power Optical Examination and Component Fracture
Documentation
Photographing the Overall Component: Cameras, Cellphones,
and Simple Digital Microscopes
Stereo Binocular Microscope
Stereoptical Microscope Camera Port and Digital Cameras for
Microscopes
Digital image Processing and Focus Stacking
Discussion Stereomicroscope
Digital Microscopes
Illumination Sources
Coatings
Size Measurements
Compound Optical Microscope
Replication Equipment
Scanning Electron Microscope
Stereo SEM Imaging
Field Emission SEM
Environmental SEM
Transmission Electron Microscope
Atomic Force Microscope (AFM)
Optical Profilometer
Confocal Scanning Light Microscope
Stress Wave and Ultrasonic Fractography
High Speed Photography
X-ray Topography
Dye Penetration and Staining
Polariscope
Other Equipment
Other Resources
The Future
General examination and fracture patterns
Specimen Reconstruction
Crack Branching Patterns
Crack Branching Angles
Crack Branching Distances
Fragmentation Patterns
Laboratory Test Fracture Patterns
Tension strength
Flexural strength
Biaxial flexural strength
Laboratory tests: additional tips
Component Fracture Patterns – General
T Intersections and Crossing Cracks
Invisible cracks
Plates and Windows
Tempered Windows
Thermally Induced Plate and Window Fractures
Bottles and Pressure Vessels
Torsional Fractures
Chipping
Laboratory Test Fractures and Component Fractures
Controlled Component Fractures
Finite Element Analysis
Characteristics of Some Common Fracture Modes
Mechanical overload fracture
Thermal fracture and thermal shock
Impact or contact fractures
Corrosion or oxidation
Residual stresses
Time dependent fracture
Compression fracture
Fracture Surface ExaminationFracture Mirrors, A Fractographer’s Best Friend
Fracture mirrors in glass
Fracture mirrors in ceramics
Fracture mirrors, special cases
Hackle
Coarse hackle
Wake hackle
Twist hackle
• Fractography of Ceramics and Glasses
Shear hackle
Corner hackle
Step hackle
Wallner LinesPrimary Wallner lines
Secondary Wallner lines
Tertiary Wallner lines
Wallner Lambda lines
Arrest Lines
Scarps
Glue Chips
Transgranular and Intergranular Fracture
Stable Crack Growth
Slow crack growth (SCG) at ambient temperature
Stable extension from local residual stress or R-curve effects
High temperature slow crack growth in ceramics
High temperature creep fracture
Mechanical fatigue from cyclic loading
Organizing all the Information -Fractographic Montages
Origins of Fracture
Origins, Flaws, and Defects
The Spatial Distribution of Flaws
Are Flaws Intrinsic or Extrinsic?
Matching Fracture Halves
External Surfaces
Volume-Distributed Flaws
Pores and Bubbles
Porous regions
Porous seams
Agglomerates
Inclusions
Compositional inhomogeneities
Large grains
Grain boundaries
Surface-Distributed Flaws
Surface voids or pits from processing
Pits from environmental exposure
Handling scratches and polishing scratches
Sharp object impact or contact
Blunt object impact or contact
Grinding and machining cracks
Chips
Other Flaws
Processing and firing cracks in ceramics
Artificial or controlled flaws, glasses and ceramics
Other glass origins
Fracture Oddities
Contaminants
Combined or Hybrid Flaws
Baseline Microstructure Origins
Geometric Sharp points or Cusps
Partially-Exposed Flaws
Glaze flaws
Microfault Pockets
Polished Microstructural Sections
Flaw Size
What to Report
Quantitative AnalysisStresses from the Extent of Fragmentation
Annealed parts
Fragmentation of tempered parts
Stresses from the Branching Distances
Annealed plates and bars
Tempered plates
Stresses from the Mirror Size
Mirror analysis and constants
How to measure mirror sizes
Fracture Mechanics Analysis of the Flaw Size
Introduction to fracture mechanics
The Newman-Raju Y factors for semielliptical surface flaws in
bending
The Newman-Raju formulas
Graphical curves for the Newman-Raju formulas
Newman-Raju formulas for deep (a/c > 1) semielliptical
surface cracks
Accuracy of the Newman-Raju formulas and alternatives
Bansal’s approximation for semielliptical surface flaws
Irregularly-shaped surface cracks
Three-dimensional, blunt, and inclined flaws
Relationship of KIc and A• Fractography of Ceramics and Glasses
Mirror to Flaw Size Ratios
Comparing Measured to Calculated Flaw Sizes
Crack Velocities from Wallner Line Analysis
Slow Crack Growth
R- curve Behavior
Indentation Mechanics
Fractal Analysis
Estimation of Residual StressesEstimates of residual stresses from fragmentation
Estimates of residual stresses from fracture mechanics
analysis of flaws
Estimates of residual stresses from fracture mirror size
analysis
Estimates of residual stresses from indention crack sizes
Estimates of residual stresses by other means
Weibull Analysis
Single Crystals
General
Preferred Cleavage Planes
Fractographic Techniques
Fracture Surface Markings
Origins
Other Sources
Ceramic and Glass Composites
Particulate, Whisker, or Self-Reinforced Ceramic Composites
Fiber-Reinforced Composites
Dental composites
Case Studies
Case 3 Conflicting Carbide Data (Silicon carbide flaws and
Case 9 Modeler’s Match (Fracture origins in MEMS scale
Case 1 Ruptured Rotor (Ceramic gas turbine rotor)
Case 2 Busted Barrel (Silicon carbide machine gun liner)
slow crack growth)
Case 4 Vulnerable Vials (Broken medicinal vials)
Case 5 Damaged Dome (AlON IR dome)
Case 6 Suffering Setter Plate (Silicon carbide furnace plate)
Case 7 Ruptured Radomes (Fused silica missile nosecones)
Case 8 Maligned Machinists
SiC micro tensile specimens) Case 10 Fractious Fractographers (A fractography round robin) Case 11 Perilous Prostheses (Four ceramic dental crowns) Case 12 Mangled Margins (Twenty dental crowns) Case 13 Ruined Refractors
Conclusions
Appendix A Bibliography
Appendix B Fractographic Case Studies
Appendix C Fracture Mirror and Branching Constants
Appendix D Guidelines for Measuring Fracture Mirrors