Taylor & Francis Group, LLC, 2013. — 336 p. — ISBN13: 9789814411189.
The field of plasma-based thin film processing has grown rapidly over the past two decades. The coating technology evolved and developed in many industries, including tooling industry and electronic or manufacturing industry. In all these fields, thin films have found their usage as decorative and metallurgical films, diffusion barriers in microelectronics, films for high-temperature applications, and cutting or forming applications. Indeed, plasma processing technology has a number of manifestations, from simple dc to pulsed glow discharges over microwave and rf plasmas to arc discharges of very specific characteristics. Due to high versatility in depositing a wide range of materials under a great range of conditions combined with high deposition rates, the plasma processing technologies have become the most preferred technologies in the last few years. However, very complex relations between the film growth conditions, forming structures and properties of thin films have to be fully understood in order to prepare new film systems with optimized properties.
This book is intended to provide a perspective look at a range of thin film plasma processing technologies and give an overview on principles of the film formation so that the complex structure–property relation can be more easily and intuitively understood.
Synthesis of New Nanostructured Materials
Thin-Film Processing
Film Formation and Structure
Me-Si-N Nanocomposite Films With a Low and Intermediate Si Content (<25 at.%)
Novel Nanocomposite Zr-Si-N Films with a High Si Content (>25 at.%)
High Si-Containing W-Si-N Nanocomposite Films
Appendixes. Characterization of Thin FilmsMechanical Properties
X-ray Diffraction Analysis
Stress Measurement
Film Thickness Measurement
Scanning Electron Microscopy
Energy Dispersive X-Ray Spectrometry
Differential Scanning Calorimetry
Thermogravimetric Analysis