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Lu Daniel, Wong C.P. Materials for Advanced Packaging

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Lu Daniel, Wong C.P. Materials for Advanced Packaging
2nd ed. — Springer, 2016. — 974 p. — ISBN 3319450972.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
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