IPC/JEDEC J-STD-033B-2005 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). October 2005. Supersedes IPC/JEDEC J-STD-033A-2002. 26 p. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages that have been classified to the levels defined in J-STD-
020. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags of 12 months from the seal date.