IPC/JEDEC J-STD-020D.1-2008 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). March 2008. Supersedes IPC/JEDEC J-STD-020D-2007. 22 p. The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability.