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Microwave Journal 2013 №11s Mobile Communications

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Microwave Journal 2013 №11s Mobile Communications
Horison House. — 44 p. — ISSN 0192-6225
A Special Supplement to Microwave Journal
Cover Feature
The Economics of GaAs and CMOS PAs: Crunch Time
Joe Madden, Mobile Experts
Technical Features
Design and Test Challenges for Next-Generation 802.11ac, ad WLAN Standards
John Harmon, Agilent Technologies Inc.
CoMP: The Most Challenging Technology
Component in LTE-Advanced 3GPP Release 11
Andreas Rössler and Meik Kottkamp,
Rohde & Schwarz
Special Reports
The Road to 5G FAQs
James Kimery, National Instruments
Smarter Antenna Front End Modules
Jeff Shamblin, Ethertronics
Product Features
Broadband LDMOS FETs for Land Mobile Radios
Freescale Semiconductor
Battery Powered PIM Tester
Kaelus (a Smiths Company)
Connector System for Mobile
Communications Market
SPINNER GmbH
Tech Briefs
High Isolation, Carrier-Grade Wi-Fi Switch
Peregrine Semiconductor
Space Saving Components Aerofl ex / Weinschel
Company Showcase
Company profi les highlighting mobile
communications infrastructure and new products
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