IPC-TR-586-2009 Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

Association Connecting Electronics Industries (IPC). March 2009. A Technical Report. 61 p. This technical report documents the Round Robin testing effort. The Round Robin test results were used by the 4-14 Plating Processes Subcommittee in the development of immersion silver maximum plating thickness. The Technical Report Compendium is divided into three information sets:
1. Test Vehicle Assembly Report by Celestica
2. Thermal Cycle Test Report by Rockwell Collins
3. Solder Joint Silver Content Calculations by Adtran Inc.