IPC-SPVC-WP-006-2003 Round Robin Testing and Analysis. Lead-free Alloys. Tin, Silver and Copper

Association Connecting Electronics Industries (IPC) and the IPC Solder Products Value Council (SPVC). July 2003. White Report. 25 p.At present there are a large number of materials that have been proposed as replacements for lead containing solder. Primary among these are the Tin/Silver/Copper (SAC) alloys.
There are several variations of the Tin/Silver/Copper alloys that have been suggested as the preferred replacements for Tin Lead solders. Two are of special interest: the Japanese adopted alloy of 96.5% Tin, 3.0% Silver and 0.5% Copper and the North American Electronics Manufacturing Initiative (NEMI) alloy of 95.5% Tin, 3.9% Silver, and 0.6% Copper.