IPC/JEDEC J-STD-035-1999 Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components

Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). MAY 1999. 18 p. This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compound voids, etc.) nondestructively in plastic packages while achieving reproducibility