IPC/JEDEC J-STD-020D-2007 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

Association Connecting Electronics Industries (IPC) and Joint Electron Devices Engineering Council (JEDEC). June 2007. Supersedes IPC/JEDEC J-STD-020C-2004. 22 p. The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices.