IPC-7351-2005 Generic Requirements for Surface Mount Design and Land Pattern Standard

Association Connecting Electronics Industries. Joint Industry Standard (IPC). February 2005. Supersedes Revision IPC-SM-782A-1999. 92 p. This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder fillet to meet the requirements of IPC/EIA J-STD-001, and also to allow for inspection, testing, and rework of those solder joints